SP-2100
A single-wafer spin processor for 76 to 200 mm Si, SiC, GaN, LiTaO₃ and other wafers. It is used for cleaning, etching and metal etching.
Maker: SCREEN Holdings · Official product page
Specifications
| Wafer size | 76 to 200 mm |
|---|---|
| Supported substrates | Si, SiC, GaN, LiTaO₃ and others |
| Chambers | Multi-task (hot strong acid), dry task |
Specifications as published by the maker. See the sources below.
Overview
SP-2100 is SCREEN's single-wafer spin processor. It carries on the well-proven pick-and-place mechanical transfer and moves wafers stably with single-pass transfer.
Besides silicon, it handles a variety of compound wafers such as SiC, GaN and LiTaO₃, covering wafer sizes from 76 mm to 200 mm. It has multi-task chambers that support cleaning and etching with hot strong acids, and dry-task chambers for rinsing and high-speed spin drying.
SCREEN's own optional endpoint sensor enables highly repeatable metal etching. Nanospray or Softspray can be chosen as cleaning tools, and a surface brush can be added for post-CMP cleaning and similar steps.
Key features
- Handles compound wafers
- Chambers for hot strong acids
- Endpoint sensor (optional)
- A range of cleaning tools
Applications
- Cleaning and etching of compound devices
- Metal etching
Other wet etching equipment
- SU-3300 · SCREEN Holdings
- EXPEDIUS™-i · Tokyo Electron (TEL)
More from SCREEN Holdings
- CW-2000 · Batch wafer cleaning equipment
- DR-8000 · Mask dimension and flatness metrology
- DT-3000 (SOKUDO DUO) · Coater/developers
- DW-3100 · Laser direct imaging systems
- FC-3100 · Batch wafer cleaning equipment
- FC-821L · Batch wafer cleaning equipment
- LA-3100 · Laser annealing equipment
- RE-3500 · Ellipsometers
Sources
Wet etching equipment
Last updated: October 23, 2026