EXPEDIUS™-i
Tokyo Electron's batch automated wet cleaning system for 300 mm wafers. It handles up to 50 wafers per batch, including highly selective oxide/nitride wet etching for 3D NAND.
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Batch (up to 50 wafers per batch) |
| Throughput | 1,000 wph |
| Main applications | Selective SiN wet etching, pre- and post-process cleaning, resist strip |
Specifications as published by the maker. See the sources below.
Overview
EXPEDIUS-i is a batch automated wet cleaning system for 300 mm wafers from Tokyo Electron. It processes up to 50 wafers at a time and runs a range of chemical treatments in multiple tanks. It is based on the EXPEDIUS+ automated wet station, with higher process performance and productivity.
Throughput is 1,000 wafers per hour, 150% higher than the previous system. In addition to conventional uses such as pre-oxidation and pre-diffusion cleaning, post-etch cleaning and resist stripping, it supports the highly selective oxide/nitride wet etching in growing demand for 3D NAND.
Optimized chemical tanks, DI water rinse tanks and drying improve cleaning and stripping performance, and selective etch technology improves control and stability during etching. The improved drying function shortens processing time substantially while suppressing the collapse of fragile patterns.
Key features
- Batch automated wet cleaning of up to 50 wafers per batch
- Throughput of 1,000 wph (150% higher than the previous system)
- Selective SiN wet etching for 3D NAND
- Improved drying that suppresses pattern collapse
Applications
- Selective SiN wet etching in 3D NAND
- Pre-oxidation and pre-diffusion cleaning, post-etch cleaning
- Resist stripping
Other wet etching equipment
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Wet etching equipment
Last updated: October 23, 2026