BGM300
A measurement system for the TSV backside grinding process that measures Si thickness, TSV depth and remaining Si thickness.
Maker: Lasertec · Official product page
Specifications
| Type | Proprietary interferometer + IR optics |
|---|---|
| Supported substrates | Φ300 mm (TSV and BSI bonded wafers) |
| Dimensions | 1,450 × 2,650 × 1,885 mm |
Specifications as published by the maker. See the sources below.
Overview
BGM300 is Lasertec's measurement system for the TSV backside grinding process, announced in August 2012. It measures Si thickness, TSV depth and remaining Si thickness (RST) in the TSV backside grinding step.
A combination of a proprietary interferometer and IR optics can measure the via areas, and it can be used both before and after backside grinding.
It is used to measure Si thickness and TSV depth before grinding and remaining Si thickness after grinding, to detect abnormal adhesive layer thickness in bonded wafers, and to measure silicon thickness during backside thinning of BSI image sensor wafers.
Key features
- Interferometer + IR optics
- Measures both before and after grinding
- Measures remaining Si thickness
Applications
- Control of TSV backside grinding
- Control of BSI sensor thinning
Other tsv formation equipment
- UFP600AS · Ebara
- VIANCA series · Lasertec
- ASE-Pegasus · SPP Technologies
- Synapse™ V / Synapse™ Z Plus · Tokyo Electron (TEL)
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Sources
TSV formation equipment
Last updated: October 23, 2026