VIANCA series
A via depth measurement system that accurately measures the depth of small, high aspect ratio vias in 3D and 2.5D packages and hybrid bonding.
Maker: Lasertec · Official product page
Specifications
| Type | Depth measurement with proprietary optics |
|---|---|
| Target | Small, high aspect ratio vias (next-generation TSV) |
| Main applications | Depth after via etching, Cu recess, bump height |
Specifications as published by the maker. See the sources below.
Overview
The VIANCA series is Lasertec's via depth measurement system, announced in December 2023. It accurately measures the depth of small, high aspect ratio vias in 3D and 2.5D packaging and hybrid bonding processes.
Its proprietary optics measure the depth of small, high aspect ratio vias and also handle next-generation TSV shapes.
It is used to measure depth after via etching, to control the amount of Cu recess in hybrid bonding, and to measure height after Cu reveal and in bump formation.
Key features
- Measures the depth of small, high aspect ratio vias
- Supports next-generation TSVs
- Control of Cu recess
Applications
- TSV depth control
- Hybrid bonding
Other tsv formation equipment
- UFP600AS · Ebara
- BGM300 · Lasertec
- ASE-Pegasus · SPP Technologies
- Synapse™ V / Synapse™ Z Plus · Tokyo Electron (TEL)
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- CIEL series · Macro inspection equipment
Sources
TSV formation equipment
Last updated: October 23, 2026