CIEL series
A high-sensitivity wafer edge inspection system that detects and classifies tiny defects on the wafer edge and bevel that could not be classified before.
Maker: Lasertec · Official product page
Specifications
| Target | Wafer edge and bevel |
|---|---|
| Functions | Identification of tiny defects, 3D measurement |
| Mode | High-throughput mode included |
Specifications as published by the maker. See the sources below.
Overview
The CIEL series is Lasertec's high-sensitivity wafer edge inspection system, announced in December 2022. It accurately classifies defects on the wafer edge and bevel that earlier tools could not handle.
It can identify tiny defects that previously could not be detected or classified, and it also has a 3D measurement function. A high-throughput mode is included for use as operations require.
It is used for process monitoring and feedback of the wafer edge and bevel in semiconductor device processes, for picking out defects that directly affect yield, and for process improvement through 3D measurement.
Key features
- Classifies tiny defects on the edge and bevel
- 3D measurement function
- High-throughput mode
Applications
- Process monitoring of the wafer edge
Other macro inspection equipment
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Sources
Macro inspection equipment
Last updated: October 23, 2026