SICA108
A SiC wafer defect inspection and review system focused on SiC-specific defects that runs surface and photoluminescence inspection simultaneously at high speed.
Maker: Lasertec · Official product page
Specifications
| Type | Simultaneous surface + photoluminescence (PL) inspection |
|---|---|
| Detection target | Surface defects, basal plane dislocations (BPD), stacking faults (SF) |
| Functions | High-precision automatic defect classification, AGV/OHT support |
Specifications as published by the maker. See the sources below.
Overview
SICA108 is Lasertec's SiC wafer defect inspection and review system, announced in September 2024. Focused on defects specific to SiC, it speeds up simultaneous surface and photoluminescence (PL) inspection.
Along with surface defects, it quickly and sensitively detects crystal defects inside the wafer such as basal plane dislocations (BPD) and stacking faults (SF). While capturing high-resolution review images of defects, it classifies them in detail with high-precision automatic defect classification (ADC).
It also supports automation with automated guided vehicles (AGV) and overhead hoist transport (OHT). It is used for outgoing and incoming inspection of SiC wafers and epitaxial wafers, process control of epitaxial growth and polishing, and process control in SiC device manufacturing.
Key features
- Simultaneous surface and PL inspection
- Detects BPD and stacking faults
- Automatic defect classification
Applications
- Inspection of SiC wafers and epitaxial wafers
- Process control of SiC epitaxy and polishing
Other crystal defect inspection equipment
All crystal defect inspection equipment and Japanese suppliers
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Sources
Crystal defect inspection equipment
Last updated: October 23, 2026