Crystal defect inspection equipment

SICA88

A SiC wafer defect inspection and review system that detects basal plane dislocations (BPD) and stacking faults (SF) inside the epitaxial layer along with surface defects.

Maker: Lasertec · Official product page

Specifications


Inspection targetSiC wafers and epitaxial wafers
Detected defectsEpitaxial defects, scratches, BPD, stacking faults (automatic classification)
Related modelsSICA108 (successor with renewed inspection optics)
Main applicationsOutgoing and incoming inspection of SiC wafers, epitaxial process control

Specifications as published by the maker. See the sources below.

Overview


SICA88 is Lasertec's SiC wafer defect inspection and review system. It performs surface inspection and photoluminescence (PL) inspection of φ6-inch SiC wafers and epitaxial wafers.

Besides surface defects, it sensitively detects crystal defects such as basal plane dislocations (BPD) and stacking faults (SF). It captures high-resolution review images and classifies defects in detail with automatic defect classification (ADC), so re-inspection under a microscope is not needed. Full-wafer inspection throughput is 10 wafers per hour.

In SiC power devices, crystal defects determine device reliability, so wafer quality control is important. SICA88 is used for outgoing and incoming inspection of SiC wafers and epitaxial wafers, for process control of epitaxial growth and polishing, and for process control in device manufacturing. It received an excellence award in the Semiconductor of the Year 2016 by the Electronic Device Industry News.

Key features


Applications


Other crystal defect inspection equipment


All crystal defect inspection equipment and Japanese suppliers

More from Lasertec


Sources


  1. Lasertec: SICA88 product page

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Crystal defect inspection equipment

Last updated: October 23, 2026