Wafer scrubbers
NS300Z
TEL's scrubber cleaning system for 300 mm wafers. It uses proven process modules and offers higher productivity.
Specifications
| Cleaning method | Brush cleaning, two-fluid spray (AS2) |
|---|---|
| Wafer size | 300 mm |
| Configuration | Front-side and backside cleaning |
| Main applications | Particle removal from both sides of the wafer |
Specifications as published by the maker. See the sources below.
Overview
NS300Z is a scrubber cleaning system for 300 mm wafers from TEL. It performs scrubber cleaning with ultrapure water (DIW).
Using two-fluid spray (AS2: Atomized Spray 2) and brush technology, it can carry up to 8 spin modules. Throughput is up to 1,000 wafers per hour, 200% of the previous model.
It prevents cross-contamination between wafers and supports wafer transfer for next-generation devices. It meets the increasingly complex cleaning requirements that come with scaling and 3D device structures.
Key features
- Two-fluid spray (AS2) plus brush
- Up to 8 spin modules
- Up to 1,000 wafers per hour (200% of the previous model)
Applications
- Particle removal from both sides of the wafer
- Cleaning steps for next-generation devices
Other wafer scrubbers
- SB-3300 · SCREEN Holdings
- SS-3200 · SCREEN Holdings
- SS-3300S · SCREEN Holdings
- SS-80EX · SCREEN Holdings
- CELLESTA™ MS2 · Tokyo Electron (TEL)
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Sources
Last updated: October 23, 2026