SB-3300
A wafer backside cleaning system that performs brush cleaning and chemical etching and cleaning at the same time. It is also used to reduce warpage.
Maker: SCREEN Holdings · Official product page
Specifications
| Type | Simultaneous brush + chemical processing (hybrid) |
|---|---|
| Configuration | 4-level towers, 16 chambers |
| Capacity | 700 wafers per hour (including flipping) |
Specifications as published by the maker. See the sources below.
Overview
SB-3300 is SCREEN's wafer backside cleaning system. With simultaneous chemical and brush processing, an industry first (as of December 2020, according to SCREEN), it removes particles from the wafer backside with high cleaning power.
Controlled etching with fine nozzle motion and chemical dispense control improves within-wafer uniformity and helps reduce wafer warpage.
SCREEN's own chuck system eliminates etch residue at the wafer edge while preventing chemicals from wrapping around to the device side. With 4-level towers and 16 chambers, it has a capacity of 700 wafers per hour for backside cleaning including wafer flipping.
Key features
- Simultaneous brush and chemical processing
- Controlled etching to reduce warpage
- Prevents chemicals reaching the device side
- 700 wafers per hour
Applications
- Particle removal from the wafer backside
- Backside etching to reduce warpage
Other wafer scrubbers
- SS-3200 · SCREEN Holdings
- SS-3300S · SCREEN Holdings
- SS-80EX · SCREEN Holdings
- CELLESTA™ MS2 · Tokyo Electron (TEL)
- NS300Z · Tokyo Electron (TEL)
More from SCREEN Holdings
- CW-2000 · Batch wafer cleaning equipment
- DR-8000 · Mask dimension and flatness metrology
- DT-3000 (SOKUDO DUO) · Coater/developers
- DW-3100 · Laser direct imaging systems
- FC-3100 · Batch wafer cleaning equipment
- FC-821L · Batch wafer cleaning equipment
- LA-3100 · Laser annealing equipment
- RE-3500 · Ellipsometers
Sources
Wafer scrubbers
Last updated: October 23, 2026