Dry cleaning equipment
Dry cleaning equipment removes particles, native oxide or residues without liquid chemicals, using gases, vapors or aerosols. Because nothing wet touches the wafer, it avoids watermarks, corrosion and pattern collapse.
What it does
It is used before contacts are formed, after etching, and on sensitive films such as copper and low-k dielectrics.
Products (3)
- ANTARES™ · Tokyo Electron (TEL)
Tokyo Electron's 300 mm single-wafer dry cleaning system, which turns gas into a low-temperature aerosol to remove only particles. It does not damage Cu or low-k films.
- Certas LEAGA™ · Tokyo Electron (TEL)
Tokyo Electron's gas chemical etch system for 300 mm wafers, which etches and cleans surfaces without liquid chemicals. It uses no plasma and leaves no watermarks.
- RISE-300 · ULVAC
A batch dry processing system that removes native oxide, for example at the bottom of deep contacts in LSIs. It processes 50 wafers of 300 mm at once.
Japanese makers in this category
- Tokyo Electron (TEL) · 2 product(s) listed
- ULVAC · 1 product(s) listed
Other front-end equipment
Sources
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Last updated: October 23, 2026