RISE-300
A batch dry processing system that removes native oxide, for example at the bottom of deep contacts in LSIs. It processes 50 wafers of 300 mm at once.
Maker: ULVAC · Official product page
Specifications
| Type | Remote plasma (microwave), low-temperature batch dry etching |
|---|---|
| Uniformity | Below ±5% (batch) |
| Processes | 50 wafers of 300 mm at once |
Specifications as published by the maker. See the sources below.
Overview
RISE-300 is ULVAC's batch native oxide removal system. It handles 300 mm wafers and removes native oxide that is hard to remove, for example at the bottom of deep contacts in LSIs.
It dry-etches repeatably with good uniformity (below ±5% across a batch). Remote plasma and a low-temperature process cause no damage, and self-aligned contact resistance is lowered to 1/2 of that with conventional wet processes.
It processes 50 wafers of 300 mm at once, giving high throughput and low cost of ownership. The structure emphasizes ease of maintenance. It is used for self-aligned contact formation, capacitor formation and pre-treatment before epitaxial growth.
Key features
- Batch processing of 50 wafers at once
- Damage-free (remote plasma, low temperature)
- Contact resistance cut to 1/2 of wet processing
Applications
- Pre-treatment for contact formation
- Pre-treatment before epitaxial growth
Other dry cleaning equipment
- ANTARES™ · Tokyo Electron (TEL)
- Certas LEAGA™ · Tokyo Electron (TEL)
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- CME-200E · CVD equipment
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- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- ENTRON-EX W300 · PVD equipment
Sources
Dry cleaning equipment
Last updated: October 23, 2026