uGmni-200C
A system that mounts a PE-CVD module on the standard uGmni core. It deposits high-quality films with fewer particles than tray-type tools.
Maker: ULVAC · Official product page
Specifications
| Plasma | 27.12 MHz high-density plasma |
|---|---|
| Film types | SiO₂, SiNx, SiON, a-Si, TEOS SiO₂ |
| Substrate size | Up to Φ200 mm |
Specifications as published by the maker. See the sources below.
Overview
uGmni-200C is ULVAC's system that mounts a PE-CVD module on the standard uGmni core. Compared with tray-type tools, it deposits high-quality films with fewer particles.
It supports high-density 27.12 MHz plasma processes and can deposit SiH₄-based SiO₂, SiNx, SiON and a-Si, and TEOS-based SiO₂ films. The chamber can be cleaned with NF₃ + Ar plasma, and it handles substrates up to Φ200 mm.
Sputtering, etching and ashing modules can also be combined on the uGmni core, and it is used to deposit insulating films for power devices, MEMS sensors, optical devices such as VCSELs, high-density packaging and communication devices.
Key features
- Mounted on the standard uGmni core
- Low particles
- Up to Φ200 mm
Applications
- Insulating films for communication and power devices
Other pecvd equipment
More from ULVAC
- CCMT-D series · Vacuum gauges
- CME-200E · CVD equipment
- CS · Sputtering equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- ENTRON-EX W300 · PVD equipment
- ENTRON-EXX · PVD equipment
- H83 / H84 · Diffusion furnaces
Sources
PECVD equipment
Last updated: October 23, 2026