PECVD equipment
PECVD (plasma-enhanced CVD) equipment uses a plasma to break up precursor gases so that films such as silicon oxide, silicon nitride and amorphous silicon can be deposited at lower temperatures than thermal CVD.
What it does
The lower temperature makes PECVD suited to films deposited after metal layers, passivation of power and compound devices, MEMS and other temperature-sensitive structures.
Products (3)
- CC-200 · ULVAC
A compact PE-CVD system for everything from R&D to small-volume production. It supports high-density 27.12 MHz plasma.
- CME · ULVAC
A tray-transfer PE-CVD system for volume production that deposits silicon-based insulating and barrier films.
- uGmni-200C · ULVAC
A system that mounts a PE-CVD module on the standard uGmni core. It deposits high-quality films with fewer particles than tray-type tools.
Japanese makers in this category
- ULVAC · 3 product(s) listed
Other front-end equipment
Sources
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Last updated: October 23, 2026