DFG8360
A high-precision 300 mm grinder that reduces the lapping load in the planarization step of wafer manufacturing.
Maker: DISCO · Official product page
Specifications
| Type | 1 spindle, 2 chuck tables (in-feed grinding) |
|---|---|
| Wafer size | Φ300 mm |
| Spindle | 7.5 kW rated, 1,000 to 4,500 min⁻¹ |
Specifications as published by the maker. See the sources below.
Overview
DFG8360 is a high-precision grinder from DISCO that achieves excellent flatness by grinding. It handles 300 mm wafers.
Planarization in wafer manufacturing generally uses batch lapping, but introducing surface grinding with DFG8360 lets thickness be adjusted stably wafer by wafer while minimizing the lapping load. A fine-mesh wheel also reduces the load on the polishing step and shortens process time.
A rigid, low-vibration spindle reduces the effects of heat and vibration for stable continuous processing. Because the processing point can be controlled to produce any wafer shape, the shape can be specified to match the requirements of later steps.
Key features
- Reduced lapping load
- Fine-mesh wheel
- Adjustable wafer shape
Applications
- Planarization in 300 mm wafer manufacturing
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026