DFG8560
A 300 mm grinder with 2 spindles and 3 chuck tables for thin finish grinding to 100 µm or less. It also supports DBG.
Maker: DISCO · Official product page
Specifications
| Type | 2 spindles, 3 chuck tables |
|---|---|
| Wafer size | Φ300 mm (Φ200 mm also possible with a universal chuck) |
| Weight | About 4,000 kg (20% lighter than DFG860) |
Specifications as published by the maker. See the sources below.
Overview
DFG8560 is a fully automatic grinder for 300 mm wafers from DISCO. It succeeds the DFG800 series and keeps the basic specifications and performance while weighing 20% less than DFG860.
Optimized grinding and transfer parameters allow stable thin finish grinding to 100 µm or less. It also supports DBG (dicing before grinding) and inline systems with the DFP8160 stress relief tool.
Aligning the grinding points of spindle 1 and spindle 2 stabilizes grinding on spindle 2 and improves flatness both within the wafer and from wafer to wafer. Wheels and other parts are compatible with the earlier 800 series.
Key features
- Thin finish to 100 µm or less
- Inline with DBG and stress relief
- Parts compatible with the 800 series
Applications
- Thinning of 300 mm wafers
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026