DFG8540
A 200 mm grinder with 2 spindles and 3 chuck tables designed for thin finish grinding to 100 µm or less.
Maker: DISCO · Official product page
Specifications
| Type | 2 spindles, 3 chuck tables |
|---|---|
| Wafer size | Φ8 inch (Φ4 to 8 inch) |
| Weight | About 3,100 kg (28% lighter than DFG850) |
Specifications as published by the maker. See the sources below.
Overview
DFG8540 is a fully automatic grinder for 200 mm wafers from DISCO. It succeeds the DFG800 series, which has a track record worldwide, and keeps the basic specifications and performance while weighing 28% less than DFG850.
Optimized grinding and transfer parameters allow stable thin finish grinding to 100 µm or less. It also supports DBG (dicing before grinding) and inline systems with the DFP8140 stress relief tool.
Aligning the grinding points of spindle 1 and spindle 2 stabilizes grinding on spindle 2 and improves flatness both within the wafer and from wafer to wafer. Wheels, dresser boards, spindles and chuck tables are compatible with the earlier 800 series.
Key features
- Thin finish to 100 µm or less
- Inline with DBG and stress relief
- Parts compatible with the 800 series
Applications
- Thinning of 200 mm wafers
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026