DFG8830
A grinder with 4 spindles and 5 chuck tables for thinning hard, brittle materials such as sapphire and SiC. Footprint is 3.5 m².
Maker: DISCO · Official product page
Specifications
| Type | 4 spindles, 5 chuck tables |
|---|---|
| Wafer size | Φ4 to 6 inch (Φ5 to 8 inch on a support substrate) |
| Key feature | Rigid, high-power spindles and large-diameter wheels |
Specifications as published by the maker. See the sources below.
Overview
DFG8830 is a DISCO grinder for thinning hard, brittle materials. It is suited to grinding sapphire, SiC and similar materials, and its rigid, high-power spindles and large-diameter grinding wheels enable fully automatic grinding of hard, brittle materials that put a heavy load on the process.
With 4 spindles, 5 chuck tables and 1 turntable, each of the four spindles can carry the best wheel for its step, meeting needs ranging from productivity-focused processing to low-damage, high-quality finishing.
It also handles workpieces bonded to support substrates such as glass or ceramics, accepting Φ5 to 8 inch and up to 3.5 mm total thickness. Despite having 4 spindles and 5 chuck tables, its footprint is a compact 3.5 m², and it can hold 4 cassettes at once.
Key features
- 4 spindles, 5 chuck tables
- Fully automatic grinding of hard, brittle materials
- Handles workpieces on support substrates
- Footprint of 3.5 m²
Applications
- Thinning of sapphire and SiC
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026