DFG8340
A fully automatic grinder for wafers of 200 mm and smaller that achieves stable, high flatness with a rigid spindle. It succeeds DFG830.
Maker: DISCO · Official product page
Specifications
| Type | 1 spindle, 2 chuck tables |
|---|---|
| Wafer size | Φ4 to 8 inch |
| Key feature | Processes with pure water only while measuring thickness in real time |
Specifications as published by the maker. See the sources below.
Overview
DFG8340 is a fully automatic grinder from DISCO. It succeeds DFG830, which has a track record worldwide, and uses a rigid spindle to minimize the effect of process heat and planarize wafers stably to high flatness.
With a simple, compact structure of 1 spindle, 2 chuck tables and 1 turntable, it can grind small amounts with low damage from silicon wafers of 8 inch and smaller, and can also process SiC, sapphire and ceramics.
Conventional lapping is a batch process using loose abrasives, and controlling the finished thickness is difficult. DFG8340 processes with pure water only while measuring wafer thickness in real time, reducing environmental impact while improving quality, so it can replace lapping. Wafer shape can be adjusted with one touch.
Key features
- High flatness with a rigid spindle
- Real-time thickness measurement
- Processing with pure water only (replaces lapping)
Applications
- Planarization in wafer manufacturing
- Grinding of SiC and sapphire
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026