DFD6760
DISCO's high-end 300 mm dicing saw that uses two chuck tables to run processing in parallel with transfer and alignment.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, facing dual spindles, dual chuck tables |
|---|---|
| Wafer size | Φ300 mm |
| Options | Non-contact wafer height measurement (NSD) |
Specifications as published by the maker. See the sources below.
Overview
DFD6760 is DISCO's high-end 300 mm dicing saw. It raises productivity further over the earlier DFD6362.
It has two chuck tables: while one is processing, the other handles transfer and alignment in parallel, shortening spindle idle time. During processing, the other table can also record images of processed workpieces and measure workpiece thickness with a non-contact height sensor (NSD).
In step cuts of thin wafers, controlling the cut depth from the surface is important. Because NSD measurement, which takes about 10 seconds, runs in parallel with processing, quality improves without lowering throughput. Saving kerf images after processing also supports traceability.
Key features
- Dual chuck tables
- Processing in parallel with transfer and inspection
- Thickness measurement with NSD (optional)
- Traceability with kerf images
Applications
- Dicing of thin 300 mm wafers
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026