DFD6560
A space-saving 300 mm dicing saw. Five units fit in the space of 4 DFD6362 units.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, facing dual spindles |
|---|---|
| Wafer size | Φ300 mm |
| Effect | 16% smaller footprint and up to about 10% higher throughput (vs. DFD6362) |
Specifications as published by the maker. See the sources below.
Overview
DFD6560 is a 300 mm dicing saw from DISCO designed around a space-saving layout.
An in-house short spindle and an optimized gantry layout reduce the footprint of the main unit by 16% compared with DFD6362. Because all maintenance can be done from the front, the layout area including the maintenance area is 20% smaller, and 5 units fit in the space of 4 earlier tools.
A thin wheel cover shortens the distance between blades and increases the number of lines that can be diced at once, raising throughput for step cuts by up to about 10%. The touch panel lets operators work by touching the microscope image, and operating status is shown in graphs. Particle control options such as a two-fluid nozzle are also available.
Key features
- 16% smaller footprint
- All maintenance from the front
- Up to about 10% higher throughput
- Particle control options
Applications
- Dicing of 300 mm wafers (lines with many tools installed)
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026