DGP8762
The next-generation 300 mm grinder/polisher that integrates everything from backgrinding to stress relief.
Maker: DISCO · Official product page
Specifications
| Type | 3 spindles, 4 chuck tables (rough grinding, fine grinding, dry polishing) |
|---|---|
| Wafer size | Φ300 mm |
| Third spindle options | Dry polishing (standard), CMP, grinding |
Specifications as published by the maker. See the sources below.
Overview
DGP8762 is DISCO's next-generation grinder/polisher for 300 mm wafers. It carries on DGP8761, which integrates backgrinding through stress relief for thin finishing.
Optimized cooling and other aspects of the processing point give high-precision, high-throughput processing. Automated dressing after wheel replacement and similar functions also reduce operator work. An optional high-torque spindle allows thinning of difficult materials such as SiC, and a load detection function prevents wafer breakage from the wheel pressing too hard.
The third spindle can be set up for dry polishing without chemicals or water (standard), polishing with a CMP pad, or 3-spindle grinding with a grinding wheel. It supports MUSUBI, a cluster system that links several tools, to automate transfer between them.
Key features
- Grinding through stress relief in one tool
- Third spindle for dry polishing, CMP or grinding
- Supports MUSUBI
- SiC thinning (optional)
Applications
- Thinning of 300 mm wafers
- DBG and SDBG
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026