Ulucus™ G
TEL's wafer thinning system that combines grinding, scrub cleaning, spin wet etching and inspection in one tool.
Specifications
| Type | Single-wafer grinding + scrub cleaning + spin wet etching |
|---|---|
| Key feature | Feedback and feedforward control from an in-tool inspection unit |
| Base | LITHIUS Pro Z platform |
Specifications as published by the maker. See the sources below.
Overview
Ulucus G is a wafer thinning system from Tokyo Electron (TEL). It combines a grinding unit developed in-house with LITHIUS Pro Z, a coater/developer platform widely proven in volume production, to raise silicon wafer quality while reducing labor in volume production.
In advanced patterning, flatness requirements for the base silicon wafer keep rising. With labor shortages, wafer manufacturing also needs continuous in-tool processing and automation.
The new grinding unit is combined with scrub cleaning and spin wet etching units, and everything is processed one wafer at a time, so quality can be controlled for each wafer. An in-tool inspection unit feeds the measurement results of each step into feedback and feedforward control, producing flat, low-damage, clean wafers without relying on operator skill.
Key features
- Grinding, cleaning, etching and inspection in one tool
- All single-wafer processing
- In-tool feedback control
Applications
- Thinning and planarization of silicon wafers
Other backgrinders
More from Tokyo Electron (TEL)
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- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Last updated: October 23, 2026