TSURUGI-C²®
KOKUSAI ELECTRIC's mini-batch thermal process system. A reactor with minimized volume combines difficult film deposition with high productivity.
Maker: Kokusai Electric · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Mini-batch (thermal) |
| Key feature | Minimized-volume reactor reduces loading effect and improves thickness uniformity |
| Related models | Advanced TSURUGI / Advanced TSURUGI Plus-Ⅲ (top model) |
Specifications as published by the maker. See the sources below.
Overview
TSURUGI-C² is KOKUSAI ELECTRIC's mini-batch deposition system for 300 mm wafers. It is positioned as a thermal process system that combines the difficult film deposition required by next-generation devices with high productivity.
A reactor with minimized volume suppresses the loading effect and improves film thickness uniformity. A low-particle, high-speed wafer transfer system gives high productivity and a small footprint.
KOKUSAI ELECTRIC calls the method of depositing films at the atomic layer level by cyclically supplying several gases ALD, and offers batch deposition systems for it together with LP-CVD, oxidation, annealing and diffusion. Its mini-batch line also includes the higher-end Advanced TSURUGI and the top model Advanced TSURUGI Plus-Ⅲ, which handle difficult deposition for 3D stacked devices.
Key features
- Wafer reactor with minimized volume reduces the loading effect
- Low-particle, high-speed wafer transfer system
- High productivity and small footprint
Applications
- Difficult thin film formation for next-generation devices (including ALD)
- Uniform deposition on 3D device structures
Other ald equipment
- Advanced TSURUGI · Kokusai Electric
- Advanced TSURUGI Plus-Ⅲ · Kokusai Electric
- NT333™ · Tokyo Electron (TEL)
- TELINDY PLUS™ IRad™ · Tokyo Electron (TEL)
More from Kokusai Electric
- AdvancedAce®-II · LPCVD equipment
- MARORA® · Rapid thermal processing (RTP) equipment
- QUIXACE®-II · CVD equipment
- QUIXACE®-LV · Epitaxial growth equipment
- TANDUO · Rapid thermal processing (RTP) equipment
- VERTEX Revolution · Oxidation furnaces
- VR300DH3 · Sheet resistance measurement
Sources
Last updated: October 23, 2026