TELINDY PLUS™ IRad™
Tokyo Electron's ALD system that adds a plasma source to the TELINDY PLUS 300 mm batch thermal processing system for very low-temperature deposition without plasma damage.
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Batch (up to 125 wafers), plasma-assisted |
| Target films | Very low-temperature ALD-SiN and ALD-SiO₂ |
| Key feature | In-situ dry gas cleaning, process temperature RT to 800 °C |
| Related models | NT333™ (semi-batch ALD) |
Specifications as published by the maker. See the sources below.
Overview
TELINDY PLUS IRad is an ALD system that adds a plasma source to the platform of TELINDY PLUS, Tokyo Electron's batch thermal processing system for 300 mm wafers. It keeps the productivity of batch processing while using plasma to deposit films at low temperature.
It provides a low-temperature deposition process without plasma damage, mainly for very low-temperature ALD-SiN and ALD-SiO₂. It also has an in-situ dry gas cleaning function.
It loads up to 125 wafers at process temperatures from room temperature to 800 °C. The base TELINDY PLUS (up to 1,100 °C) covers ALD, CVD, oxidation and annealing, and the TELINDY series has shipped more than 10,000 units. TEL also offers NT333, a semi-batch ALD system.
Key features
- Plasma source added to the TELINDY PLUS batch thermal processing system
- Very low-temperature ALD without plasma damage
- Up to 125 wafers, process temperature RT to 800 °C
- In-situ dry gas cleaning
Applications
- Very low-temperature ALD-SiN and ALD-SiO₂
- Batch ALD for steps that need a low thermal budget
Other ald equipment
- Advanced TSURUGI · Kokusai Electric
- Advanced TSURUGI Plus-Ⅲ · Kokusai Electric
- TSURUGI-C²® · Kokusai Electric
- NT333™ · Tokyo Electron (TEL)
More from Tokyo Electron (TEL)
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- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
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- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Last updated: October 23, 2026