DFD6450
A fully automatic dicing saw with a parallel dual structure in which two spindles sit side by side. It also handles singulation with multiple blades.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, parallel dual spindles |
|---|---|
| Wafer size | Φ200 mm |
| Spindle | 1.0 kW air spindle standard (2.2 kW optional) |
Specifications as published by the maker. See the sources below.
Overview
DFD6450 is a DISCO fully automatic dicing saw with a parallel dual structure, with two spindles placed side by side. It carries on the basic concept of the earlier DFD651 and joins the DFD6000 series.
It covers many applications, such as cutting and grooving Si and compound semiconductor devices, electronic components such as ceramics, and optical components such as glass. Its own structure supports the spindles from the rear of the tool, so access from the front is unrestricted and blade replacement and maintenance are easy.
It also handles special applications such as package singulation with multiple blades. It has a 15-inch LCD touch panel, a shaft lock mechanism and a cutting water flow controller.
Key features
- Parallel dual spindles
- Easy access from the front
- Supports multi-blade processing
Applications
- Cutting compound semiconductors and electronic components
- Package singulation
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026