DFD6362
A fully automatic dicing saw that raises productivity for Φ300 mm wafers. Shorter spacing between its facing dual spindles speeds up dual cutting.
Maker: DISCO · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Spindle configuration | Facing dual spindles |
| Automation | Automated blade replacement and pre-cut (about 60 seconds per replacement) |
| Key feature | Faster X-axis return and main transfer, about 7% higher throughput than the previous model |
| Main applications | Volume blade dicing of 300 mm wafers |
Specifications as published by the maker. See the sources below.
Overview
DFD6362 is a fully automatic dicing saw that DISCO offers for volume production of Φ300 mm wafers. Its facing dual spindle configuration places two spindles opposite each other, so one wafer can be cut by two blades at the same time (dual cut).
Improvements over the previous model are a shorter distance between the spindles and faster X-axis return and main transfer. As a result, throughput is said to be about 7% higher than the previous model. The optional automatic blade changer (ABC) automates blade replacement through pre-cut (dressing), taking about 60 seconds per replacement. It reads a 2D code on the back of the blade to prevent mix-ups.
Spindles can be chosen from 1.2 kW, 1.8 kW and a high-speed version (2.2 kW, 20,000 to 80,000 min⁻¹) to suit the workpiece.
Key features
- Dual cutting with facing dual spindles shortens cutting time per wafer
- Shorter spindle spacing and faster transfer raise throughput by about 7% over the previous model
- Automatic blade changer (ABC, optional) automates blade replacement and pre-cut in about 60 seconds
- Reading the 2D code on the back of the blade prevents human mix-ups
- Contamination control options such as a chuck table water curtain (CTWC)
Applications
- Volume blade dicing (singulation) of Φ300 mm wafers
- High-mix dicing on back-end lines (spindle power and speed chosen for the application)
FAQ
What wafer sizes does DFD6362 support?
The maximum workpiece size is Φ300 mm. The X-axis cutting range is 310 mm, and its main application is volume dicing of 300 mm wafers.
Can blade replacement be automated?
The optional automatic blade changer (ABC) automates blade replacement through pre-cut. DISCO gives the replacement time as about 60 seconds.
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026