DFD6363
DISCO's flagship 300 mm dicing saw with high process extensibility. It supports an automatic blade changer.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, facing dual spindles |
|---|---|
| Wafer size | Φ300 mm (two-way frame/wafer transfer optional) |
| Spindle | In-house 1.8 kW (60,000 min⁻¹) |
Specifications as published by the maker. See the sources below.
Overview
DFD6363 is DISCO's flagship dicing saw for 300 mm wafers. It offers high process extensibility.
It supports frame transfer and optional two-way frame/wafer transfer, so one tool can handle many processes such as full cuts and half cuts, reducing changeover work and errors. It accepts both 200 mm and 300 mm standard cassettes and FOUPs.
The optional automatic blade changer (ABC) detects blade life automatically and fully automates everything from replacement to resuming processing, minimizing downtime. Other features include an easy-to-read GUI on a 19-inch monitor, shorter process time through multi-axis synchronized control, and stable processing with an in-house 1.8 kW spindle (60,000 min⁻¹).
Key features
- Two-way transfer (optional)
- Automatic blade changer (optional)
- 19-inch monitor
- In-house 1.8 kW spindle
Applications
- A wide range of dicing on 300 mm wafers
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026