DFD6361
A full-featured 300 mm dicing saw with facing dual spindles.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, facing dual spindles |
|---|---|
| Wafer size | Φ300 mm |
| Spindle | 1.2 kW standard (1.8 kW and 2.2 kW optional) |
Specifications as published by the maker. See the sources below.
Overview
DFD6361 is a fully automatic dicing saw for 300 mm wafers from DISCO. It is a further developed 300 mm tool with a full set of functions.
The facing dual spindle structure and a shorter distance between blades raise throughput, and optional non-contact setup (NCS) on both spindles greatly reduces downtime for setup. A synchro spindle stabilizes processing quality.
Automatic opening and closing of the wheel cover and a spindle shaft lock make blade replacement easier, and condition monitoring and cutting water flow control can be handled on screen. Choosing a 1.8 kW or 2.2 kW spindle allows heavy-load processing of glass, ceramics and similar materials. A gantry structure keeps the footprint small.
Key features
- Dual-spindle tool for 300 mm
- NCS (optional)
- Synchro spindle
- Compact gantry structure
Applications
- Dicing of 300 mm wafers
- DBG
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026