DFD6340
DISCO's standard dual dicing saw for 200 mm wafers, with 30 to 40% higher throughput than the previous model.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, facing dual spindles |
|---|---|
| Wafer size | Φ200 mm |
| Effect | 30 to 40% higher throughput and 17% smaller footprint (vs. DFD651) |
Specifications as published by the maker. See the sources below.
Overview
DFD6340 is DISCO's standard dual dicing saw. It handles 200 mm wafers and is also used for DBG (dicing before grinding) and package singulation.
Two spindles placed opposite each other (facing dual) and a shorter distance between the blade axes raise throughput compared with the earlier DFD651 by up to about 30% for step and bevel cuts and about 40% for dual cuts. A gantry structure and a space-saving transfer section shrink the footprint by 17%, and power and air consumption are reduced by up to 33% and 24%.
A synchro spindle stabilizes processing quality. Non-contact setup (NCS) and high-magnification microscopes can be added to both spindles as options to shorten setup and kerf check time.
Key features
- Facing dual spindles
- 30 to 40% higher throughput
- 17% smaller footprint
- 33% less power and 24% less air
Applications
- Dicing of 200 mm wafers
- DBG and package singulation
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026