M-600 / 6000 series
Etching systems for silicon processing of power semiconductors. They handle 150 mm and 200 mm wafers and produce smooth sidewalls with low-temperature etching and TM bias.
Maker: Hitachi High-Tech · Official product page
Specifications
| Type | Microwave ECR plasma, low-temperature etching, TM bias |
|---|---|
| Wafer size | 150 / 200 mm |
| System configuration | Up to 2 etching + 2 post-treatment chambers |
Specifications as published by the maker. See the sources below.
Overview
The M-600/6000 series are Hitachi High-Tech's conductor etching systems. They handle silicon processing for power semiconductors used in digital mobile devices, home appliances, automobiles, railways and more.
In addition to high-density microwave ECR plasma, low-temperature etching and TM (Time Modulation) bias technology allow clean processes with little deposition, giving smooth sidewall profiles and high productivity.
They handle 150 mm and 200 mm wafers and can carry up to 2 etching chambers and 2 post-treatment chambers.
Key features
- High-density microwave ECR plasma
- Low-temperature etching and TM bias
- Supports 150/200 mm
Applications
- Silicon trench etching for power semiconductors
Other power semiconductor manufacturing equipment
- EXAVIS · Advantest
- MT100 / MT200 · Advantest
- SU-3300 · SCREEN Holdings
All power semiconductor manufacturing equipment and Japanese suppliers
More from Hitachi High-Tech
- 9000 series · Polysilicon etchers
- ArBlade® 5000 · Decapsulation and cross-sectioning equipment
- CG7300 · CD-SEMs
- CR7300 · Review SEMs
- CS5000 · CD-SEMs
- CT1000 · Review SEMs
- CV7300 · CD-SEMs
- DI2800 · Optical wafer inspection equipment
Sources
Power semiconductor manufacturing equipment
Last updated: October 23, 2026