EXIM™
TEL's PVD system that deposits ultra-multilayer films such as those for STT-MRAM with high productivity. Process modules can be arranged freely.
Specifications
| Type | Multi-cathode PVD |
|---|---|
| Target | Perpendicular MTJs (ultra-multilayer films of 20 or more layers) |
| Awards | Semiconductor of the Year 2015 |
Specifications as published by the maker. See the sources below.
Overview
EXIM is a PVD system from Tokyo Electron (TEL). It offers unprecedented flexibility and extensibility to achieve high productivity even for ultra-multilayer memory stacks such as perpendicular MTJ elements.
Built on a completely different concept from conventional PVD tools, it lets process modules be arranged freely as needed, covering everything from development to volume production. A new deposition method raises uptime, reduces particles and gives good within-wafer uniformity and repeatability. Its multi-cathode sputtering sources offer excellent control of interfaces and composition.
It combines high productivity with process performance in the ultra-multilayer steps of 20 or more layers that are central to manufacturing STT-MRAM, regarded as a key next-generation memory. It received the Semiconductor of the Year 2015 award.
Key features
- Process modules can be arranged freely
- Multi-cathode sputtering
- Handles ultra-multilayer films of 20 or more layers
Applications
- MTJ stacks for STT-MRAM
Other pvd equipment
- LEXIA™-EX · Tokyo Electron (TEL)
- ENTRON-EX W300 · ULVAC
- ENTRON-EXX · ULVAC
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
PVD equipment
Last updated: October 23, 2026