LEXIA™-EX
Tokyo Electron's multi-cathode PVD system for 300 mm wafers. It handles films from MTJs (magnetic tunnel junctions) and metals to hard masks for DRAM capacitors.
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Multi-cathode / dual-cathode PVD |
| Throughput | 100 wph (more than 20% higher than the previous model) |
| Key feature | About 40% smaller footprint and about 14% lower CO₂ emissions |
| Related models | EXIM (ultra-multilayer films for STT-MRAM) |
Specifications as published by the maker. See the sources below.
Overview
LEXIA-EX is a PVD (sputtering) system for 300 mm wafers from Tokyo Electron. Besides multi-cathode PVD, it also supports dual-cathode PVD.
It covers an unusually wide range of films: magnetic tunnel junctions (MTJ), metal films, metal oxide and nitride films, next-generation hard masks for DRAM capacitors, functional films for advanced logic and films for NAND.
Throughput is 100 wph, more than 20% higher than the previous model, while footprint is about 40% smaller and CO₂ emissions about 14% lower. EXIM in the same series is a tool for STT-MRAM that deposits ultra-multilayer stacks of more than 20 layers, such as perpendicular MTJs, with high productivity and excellent control of interfaces and composition.
Key features
- Multi-cathode and dual-cathode PVD
- Throughput of 100 wph (more than 20% higher than the previous model)
- About 40% smaller footprint and about 14% lower CO₂ emissions
Applications
- MTJ (MRAM), metal films and metal oxide/nitride films
- Next-generation hard masks for DRAM capacitors
- Functional films for advanced logic and NAND
Other pvd equipment
- EXIM™ · Tokyo Electron (TEL)
- ENTRON-EX W300 · ULVAC
- ENTRON-EXX · ULVAC
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
PVD equipment
Last updated: October 23, 2026