TELFORMULA™
TEL's 300 mm thermal processing and deposition system that minimizes turnaround time from wafer loading to unloading, a long-standing weakness of batch furnaces.
Specifications
| Type | Vertical batch thermal processing and deposition (short TAT) |
|---|---|
| Key feature | Fast ramp heater, all-quartz reactor surfaces and dry gas cleaning |
| Main applications | CVD Si, SiN and SiO₂, high-k ALD, oxidation and annealing |
Specifications as published by the maker. See the sources below.
Overview
TELFORMULA is a thermal processing and deposition system for 300 mm wafers from Tokyo Electron (TEL). It minimizes the turnaround time (TAT) from loading wafers to unloading them, which had been a challenge for earlier batch systems.
TEL developed its own fast ramp heater that heats quickly to the target temperature and cools rapidly after the reaction, minimizing the heat capacity of the reactor and maximizing gas exchange efficiency. A new high-speed mechanism also shortens wafer transfer time.
For high cleanliness, all surfaces inside the reactor are quartz, kept clean by dry gas cleaning. It covers a wide range of applications, including CVD Si (poly-Si, a-Si), SiN, SiO₂, high-k ALD, atmospheric and low-pressure oxidation, radical oxidation, oxynitridation and various anneals.
Key features
- Batch thermal processing with short TAT
- TEL's own fast ramp heater
- All-quartz reactor surfaces
Applications
- CVD Si, SiN and SiO₂
- Oxidation, radical oxidation and annealing
- High-k ALD
Other diffusion furnaces
- QUIXACE®-II · Kokusai Electric
- ALPHA-8SE™ i · Tokyo Electron (TEL)
- EVAROS™ · Tokyo Electron (TEL)
- TELINDY PLUS · Tokyo Electron (TEL)
- H83 / H84 · ULVAC
More from Tokyo Electron (TEL)
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
- Certas LEAGA™ · Dry cleaning equipment
Sources
Diffusion furnaces
Last updated: October 23, 2026