Diffusion furnaces

EVAROS™

TEL's batch thermal deposition system that processes 200 wafers of 300 mm size at a time. It cuts CO₂ emissions per wafer by about 25% compared with TELINDY PLUS.

Maker: Tokyo Electron (TEL) · Official product page

Specifications


TypeVertical batch thermal processing and deposition
Wafers per batchUp to 200 (300 mm)
Main applicationsALD SiO₂, ALD SiN, poly-Si

Specifications as published by the maker. See the sources below.

Overview


EVAROS is a batch thermal processing and deposition system for 300 mm wafers from Tokyo Electron (TEL). It can process up to 200 product wafers at a time, the most of any TEL furnace to date, and together with shorter wafer transfer times this gives very high productivity.

A newly developed multi-zone heater with improved dynamic response gives high temperature uniformity and greatly shortens the time needed to ramp and stabilize temperature. Larger exhaust piping raises conductance and allows precise film control for ALD and other processes in high-end devices.

Lower power, cooling water and gas consumption cut CO₂ emissions per wafer by about 25% compared with the earlier TELINDY PLUS. It also has automatic position adjustment for the wafer transfer robot and a new system controller designed for future autonomous tool operation. Supported applications are ALD SiO₂, ALD SiN and poly-Si, with plans to add high-k and others.

Key features


Applications


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More from Tokyo Electron (TEL)


Sources


  1. TEL: TELINDY series product page

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Last updated: October 23, 2026