TELINDY PLUS
Tokyo Electron's batch thermal processing system for 300 mm wafers. A flagship platform that handles oxidation, diffusion and deposition in a vertical furnace.
Specifications
| Type | Batch (vertical furnace) |
|---|---|
| Wafer size | 300 mm |
| Maximum load | 125 wafers |
| Process temperature | RT to 1,100 °C |
| Series | TELINDY PLUS / TELINDY PLUS IRad (plasma ALD) / EVAROS |
| Related models | TELFORMULA, ALPHA-8SE i |
| Main applications | Oxidation, diffusion and batch deposition |
Specifications as published by the maker. See the sources below.
Overview
TELINDY PLUS is a batch thermal processing system for 300 mm wafers from Tokyo Electron (TEL). The TELINDY series has shipped more than 10,000 units and is known for high productivity per unit of cleanroom floor area.
It loads up to 125 wafers at process temperatures from room temperature to 1,100 °C. Applications range from ALD (SiO₂, SiN, high-k) and CVD (poly-Si, a-Si, SiO₂, SiN) to oxidation, radical oxidation and annealing. An improved wafer transfer mechanism, FTPS heaters and 2-boat operation shorten turnaround time and raise productivity.
TELINDY PLUS IRad is a derivative that adds a plasma source to the same platform for very low-temperature ALD (SiN, SiO₂) without plasma damage. The series also includes EVAROS, which processes 200 wafers at a time and cuts CO₂ emissions by about 25%, and TELFORMULA, which offers fast ramp-up and cool-down.
Key features
- Batch processing of up to 125 wafers at RT to 1,100 °C
- ALD, CVD, oxidation and annealing on a single platform
- Short turnaround with 2-boat operation and FTPS heaters
- TELINDY series installed base of more than 10,000 units
Applications
- Thermal and radical oxidation, such as gate oxides
- Batch CVD of polysilicon and nitride films
- Batch ALD of SiO₂, SiN and high-k films
Also listed under: Oxidation furnaces
FAQ
What is the difference between TELINDY PLUS and TELINDY PLUS IRad?
IRad adds a plasma source to the TELINDY PLUS platform and is used for very low-temperature ALD-SiN and ALD-SiO₂ deposition without plasma damage. The maximum process temperature is 1,100 °C for TELINDY PLUS and 800 °C for IRad.
Other diffusion furnaces
- QUIXACE®-II · Kokusai Electric
- ALPHA-8SE™ i · Tokyo Electron (TEL)
- EVAROS™ · Tokyo Electron (TEL)
- TELFORMULA™ · Tokyo Electron (TEL)
- H83 / H84 · ULVAC
More from Tokyo Electron (TEL)
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- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
- Certas LEAGA™ · Dry cleaning equipment
Sources
Diffusion furnaces
Last updated: October 23, 2026