WDF™ 12DP+
TEL's dicing frame prober that transfers and tests both 300 mm wafers and 300 mm dicing frames without a change kit.
Specifications
| Target | 200/300 mm wafers and 300 mm dicing frames |
|---|---|
| XY accuracy | ±1.8 µm |
| Functions | N-Shot alignment (before and after dicing) |
Specifications as published by the maker. See the sources below.
Overview
WDF 12DP+ is the latest dicing frame prober from Tokyo Electron (TEL). It can transfer and test both 300 mm wafers and 300 mm dicing frames without a change kit, and an optional conversion kit lets it handle 200 mm dicing frames as well.
It supports many test formats, including thin wafers for TSV and other advanced packages, post-dicing assurance for wafer-level packages and KGD, and strip frame transfer. Defects caused by dicing or singulation can be tested electrically right after those steps to assure KGD.
For testing WLCSP, fan-out WLP and panel-scale packages, TEL's own N-Shot alignment algorithm gives accurate multi-point measurement before and after dicing. Electrostatic discharge protection has also been improved.
Key features
- Tests both wafers and dicing frames
- No change kit needed
- N-Shot alignment
Applications
- KGD assurance after dicing
- Test of WLCSP and FOWLP
Other wafer probers
- HA1200 · Advantest
- Cellcia™ · Tokyo Electron (TEL)
- Precio octo™ · Tokyo Electron (TEL)
- Precio™ XL · Tokyo Electron (TEL)
- Prexa™ · Tokyo Electron (TEL)
- Prexa™ MS · Tokyo Electron (TEL)
- UF3000EX-e · Tokyo Seimitsu (ACCRETECH)
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
- Certas LEAGA™ · Dry cleaning equipment
Sources
Last updated: October 23, 2026