Toshiba Electronic Devices & Storage

Toshiba's semiconductor and storage company, formed in 2017. It makes power MOSFETs, IGBTs and other discretes, and completed a new 300 mm power semiconductor fab at Kaga Toshiba Electronics in Ishikawa in 2024.

東芝デバイス&ストレージ・Chipmakers・Last updated: October 22, 2026

Overview

Toshiba Electronic Devices & Storage was established in July 2017 and has its operating headquarters in Kawasaki, Kanagawa. Its main power semiconductor production base is Kaga Toshiba Electronics in Nomi, Ishikawa.

Toshiba began building a new 300 mm wafer fab for power semiconductors at Kaga Toshiba in 2023 and held a completion ceremony in May 2024. When phase 1 reaches full operation, Toshiba expects its power semiconductor capacity, mainly MOSFETs and IGBTs, to be 2.5 times that of fiscal 2021.

Business: Power MOSFETs, IGBTs and discrete semiconductors

Why it matters

Moving power devices to 300 mm wafers lowers cost per chip, a shift Toshiba, Renesas and Infineon have all made.
Toshiba's former memory business is now Kioxia, so this company covers Toshiba's remaining semiconductor operations.

Main products

  • •Power MOSFETs
  • •IGBTs
  • •Diodes and small-signal devices
  • •Motor control and analog ICs

Sites in Japan

Operating headquartersHeadquarters

Kawasaki, Kanagawa

Kaga Toshiba ElectronicsPlant

Nomi, Ishikawa

Himeji semiconductor plantPlant

Taishi, Hyogo

Products (1)

Fabs operated

  • Kaga Toshiba Electronics (Nomi, Ishikawa): Power semiconductors and discrete devices

Related pages

Sources

  1. Toshiba: construction of a 300 mm wafer fab for power semiconductors (Apr 24, 2023)
  2. Toshiba Electronic Devices & Storage: company profile
  3. Wikipedia (Japanese): Kaga Toshiba Electronics
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