Sputtering equipment
Sputtering equipment deposits thin films by bombarding a target with ions in a plasma so that atoms are ejected and land on the wafer. It handles metals, alloys and many compounds, and can deposit several materials in sequence or at the same time.
What it does
Besides front-end metallization, sputtering is widely used for electrodes and seed layers in power devices, packaging, MEMS, optical and communication devices.
Products (5)
- CS · ULVAC
A single-chamber sputtering system for R&D through small-scale production. Multiple cathodes allow stacked film deposition.
- ENTRON-EX W300 · ULVAC
A multi-chamber sputtering system qualified at many volume fabs. It is the earlier model before ENTRON-EXX.
- ENTRON-EXX · ULVAC
ULVAC's multi-chamber deposition system. The successor to ENTRON-EX W300, it carries up to 12 PVD, pre-clean, heating and cooling modules.
- SME · ULVAC
A sputtering system that can carry 1 to 7 process chambers, serving optical, packaging, MEMS, power and communication devices.
- SRH · ULVAC
A production sputtering system for packaging and power devices. It can automatically transfer ultra-thin wafers down to 50 µm thick.
Japanese makers in this category
- ULVAC · 5 product(s) listed
Other front-end equipment
Sources
Related calculators
Last updated: October 23, 2026