SME
A sputtering system that can carry 1 to 7 process chambers, serving optical, packaging, MEMS, power and communication devices.
Maker: ULVAC · Official product page
Specifications
| Substrate size | Up to Φ200 mm |
|---|---|
| Configuration | SME-200E (up to 3 chambers), 200J (up to 5), 200 (up to 7) |
| Functions | Substrate heating, co-deposition, rotating deposition |
Specifications as published by the maker. See the sources below.
Overview
SME is ULVAC's sputtering system. Depending on the shape of the core, it can flexibly carry from 1 to 7 process chambers, offering high cost performance.
It meets the needs of many processes, including optical devices, packaging, MEMS and electronic components, power devices and communication devices. Process modules dedicated to each application are available, with substrate heating, co-deposition and rotating deposition.
It can transfer Φ200 mm substrates. SME-200E, with a 4-sided core, has up to 3 sputtering chambers; SME-200J, with a 6-sided core, up to 5; and SME-200, with an 8-sided core, up to 7.
Key features
- 1 to 7 process chambers
- Process modules for each application
- Co-deposition and rotating deposition
Applications
- Deposition for MEMS, power and communication devices
- LEDs
Other sputtering equipment
- CS · ULVAC
- ENTRON-EX W300 · ULVAC
- ENTRON-EXX · ULVAC
- SRH · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- H83 / H84 · Diffusion furnaces
- HELIOT 900 series · Leak detectors
Sources
Sputtering equipment
Last updated: October 23, 2026