SRH
A production sputtering system for packaging and power devices. It can automatically transfer ultra-thin wafers down to 50 µm thick.
Maker: ULVAC · Official product page
Specifications
| Supported wafers | Φ125 to 200 mm (automatic transfer down to 50 µm thick) |
|---|---|
| Material | 5 materials: Al, AlSi, Ti, Ni, Au or Ag |
| Pre-treatment | ISM sputter etching |
Specifications as published by the maker. See the sources below.
Overview
SRH is ULVAC's production sputtering system for packaging and power devices. It deposits metals with high precision to form reliable connection layers.
It supports automatic transfer of ultra-thin wafers down to 50 µm thick and cools them efficiently with an electrostatic chuck (ESC). It can carry 5 materials: Al, AlSi, Ti, Ni, and Au or Ag.
ISM sputter etching allows pre-cleaning. It handles Φ125 to 200 mm substrates and is used for power devices and for forming seed layers for electroplating and UBM (under bump metal) in WL-CSP.
Key features
- Handles ultra-thin wafers of 50 µm
- Carries 5 metals
- Pre-treatment by ISM sputter etching
Applications
- Backside electrodes for power devices
- Seed layers and UBM for WL-CSP
Other sputtering equipment
- CS · ULVAC
- ENTRON-EX W300 · ULVAC
- ENTRON-EXX · ULVAC
- SME · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- H83 / H84 · Diffusion furnaces
- HELIOT 900 series · Leak detectors
Sources
Sputtering equipment
Last updated: October 23, 2026