DUV lithography systems

NSR-S333F

Nikon's ArF (dry) scanner built on the ArF immersion scanner platform. It combines 300 wafers per hour or more with MMO of 4 nm or less.

Maker: Nikon · Official product page

Specifications


Light source and NAArF dry (193 nm), 0.92
Resolution65 nm or less
Overlay accuracyMMO 4 nm or less
Throughput300 wafers per hour or more (96 shots)

Specifications as published by the maker. See the sources below.

Overview


NSR-S333F is Nikon's ArF (dry) scanner. It combines the optics of earlier ArF scanners with the platform of NSR-S636E, Nikon's top ArF immersion scanner, raising productivity and overlay accuracy. It supports fine patterning of a wide range of devices, including logic, memory and image sensors.

Faster wafer and reticle stages achieve throughput of 300 wafers per hour or more (300 mm, 96 shots), and more stable operation raises productivity to about 1.5 times that of the earlier NSR-S322F.

It carries on the proven optics of NSR-S322F and improves wafer alignment measurement, reticle stage measurement and autofocus to achieve overlay accuracy of MMO 4 nm or less, the best in the industry for ArF scanners (as of September 2025, according to Nikon). It has Bird's Eye Control, which measures the stage from directly above with encoders; Stream Alignment, with straight-line AF and a 5-eye FIA; and Modular2 Structure, which modularizes the tool unit by unit.

Key features


Applications


Other duv lithography systems


All duv lithography systems and Japanese suppliers

More from Nikon


Sources


  1. Nikon: NSR-S333F product page

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DUV lithography systems

Last updated: October 23, 2026