DUV lithography systems

NSR-S625E

Nikon's ArF immersion scanner for mid-critical layers. Throughput is about 1.3 times the previous model, and it carries iAS.

Maker: Nikon · Official product page

Specifications


Light source and NAArF immersion (193 nm), 1.35
Resolution38 nm or less
Overlay accuracyMMO 2.5 nm or less
Throughput280 wafers per hour or more (96 shots)

Specifications as published by the maker. See the sources below.

Overview


NSR-S625E is Nikon's ArF immersion scanner for mid-critical layers. It carries on the proven Streamlign Platform and is designed for producing advanced semiconductor structures.

Throughput is about 1.3 times that of the previous NSR-S622D, and operating stability is also much better. It also carries the inline Alignment Station (iAS), which performs multi-point alignment on every shot without lowering throughput to improve overlay accuracy.

Resolution is 38 nm or less, NA 1.35, reduction ratio 1:4 and maximum exposure field 26 × 33 mm. Same-model overlay accuracy (MMO) is 2.5 nm or less, and throughput is 280 wafers per hour or more (96 shots).

Key features


Applications


Other duv lithography systems


All duv lithography systems and Japanese suppliers

More from Nikon


Sources


  1. Nikon: NSR-S625E product page

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DUV lithography systems

Last updated: October 23, 2026