DUV lithography systems

NSR-S635E

Nikon's ArF immersion scanner with an integrated inline Alignment Station (iAS). The Streamlign platform gives high productivity.

Maker: Nikon · Official product page

Specifications


Light sourceArF immersion (193 nm)
Numerical aperture (NA)1.35
Resolution38 nm or less
Throughput275 wafers per hour or more (96 shots)
Overlay accuracyMMO 2.1 nm or less
Related modelsNSR-S636E (successor)

Specifications as published by the maker. See the sources below.

Overview


NSR-S635E is Nikon's ArF immersion scanner. It was developed for volume production of leading-edge semiconductors and integrates an inline Alignment Station (iAS).

The light source is an ArF excimer laser with a wavelength of 193 nm, the numerical aperture is 1.35, the reduction ratio is 1:4 and the maximum exposure field is 26 × 33 mm. Resolution is 38 nm or less.

Using the efficiency of the Streamlign platform, it combines overlay accuracy of 2.1 nm or less MMO (mix-and-match overlay) with throughput of 275 wafers per hour or more at 96 shots. Nikon's lineup also includes the successor NSR-S636E (280 wafers per hour or more).

Key features


Applications


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More from Nikon


Sources


  1. Nikon: NSR-S635E product page
  2. NSR-S635E catalog (PDF)

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DUV lithography systems

Last updated: October 23, 2026