uGmni-200E
A cost-conscious dry etching system that scales from one chamber to multiple chambers.
Maker: ULVAC · Official product page
Specifications
| Type | Magnetically assisted ICP (ISM; ISM-duo optional) |
|---|---|
| Configuration | Single to multiple chambers; ashing chambers can be added |
| Main applications | Compound and power devices, metal wiring, ferroelectrics, magnetic materials |
Specifications as published by the maker. See the sources below.
Overview
uGmni-200E is ULVAC's dry etching system. It scales from one chamber to multiple chambers, with extensibility focused on cost performance.
A star electrode that prevents deposits on the RF window and a heating function improve repeatability and stability. The optional ISM-duo controls uniformity through the RF distribution ratio between antennas split into inner and outer sections. Process chambers that allow twice the gas flow of ULVAC's standard, and chambers with high-temperature heating, can also be chosen.
Etching and ashing chambers can be added, and in the ashing chamber, microwave water plasma treatment that prevents corrosion after metal etching can also be chosen. It is used for compound devices such as LEDs, LDs, VCSELs and RF devices, power devices such as IGBT wiring and SiC processing, metal wiring, gate electrodes, and processing of ferroelectrics, noble metals and magnetic materials.
Key features
- Scales from one chamber to multiple chambers
- Uniformity control with ISM-duo
- Water plasma treatment to prevent corrosion
Applications
- Production etching of power and compound devices
Other dry etching equipment
- VERSALINE® ICP · Plasma-Therm Japan
- Tactras™ · Tokyo Electron (TEL)
- NE-550EX · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- CS · Sputtering equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- ENTRON-EX W300 · PVD equipment
Sources
Dry etching equipment
Last updated: October 23, 2026