Resonac
A materials group launched in 2023 by integrating Showa Denko and Showa Denko Materials (formerly Hitachi Chemical). It is a major supplier of back-end packaging materials, CMP slurries and SiC epitaxial wafers.
レゾナック・Materials・Last updated: October 15, 2026
Overview
Resonac is headquartered in Minato, Tokyo. The merger combined Showa Denko's front-end materials, such as high-purity gases and SiC epitaxial wafers, with Hitachi Chemical's packaging materials.
Packaging materials such as encapsulants and die-bonding films matter more as chips move to advanced packaging, where several dies are combined in one package.
Business: CMP slurries, packaging materials and SiC epitaxial wafers
Why it matters
Main products
- •CMP slurries and pads
- •Epoxy molding compounds and die-bonding films for packaging
- •SiC epitaxial wafers for power devices
Sites in Japan
Minato, Tokyo
Hitachi, Ibaraki
Chikusei, Ibaraki
Ichihara, Chiba
Shunan, Yamaguchi