DIS100
A chip inspection system that picks chips from diced wafers and fully automatically measures thickness, chipping, backside roughness and die strength.
Maker: DISCO · Official product page
Specifications
| Wafer size | Φ200 / 300 mm |
|---|---|
| Supported chips | 2 mm square or larger |
| Measurements | Thickness, chipping, backside roughness, 3-point bending die strength |
Specifications as published by the maker. See the sources below.
Overview
DIS100 is DISCO's fully automatic chip inspection system. It picks chips from diced wafers and fully automatically measures thickness and chipping, backside roughness and die strength (a destructive test).
Full automation minimizes the variation of manual die strength measurement and allows efficient chip quality control. Die strength is measured by a 3-point bending test, and the fracture is also observed.
As an option, chips can be moved after side and backside measurement to UNITRAY, DISCO's own tray, for compact storage, and chip information can be attached to the tray as a barcode for traceability.
Key features
- Fully automatic from pickup to strength measurement
- 3-point bending die strength measurement
- Transfer to UNITRAY (optional)
Applications
- Quality control of chips after dicing and grinding
Other final test equipment
- 7038 System-Level Test System · Advantest
- T2000 · Advantest
- Prexa™ SDP · Tokyo Electron (TEL)
More from DISCO
Sources
Final test equipment
Last updated: October 23, 2026