CVD equipment

Triase+™ W

Name: Triase+ W
Brand: Tokyo Electron (TEL)

The tungsten CVD configuration of Triase+, Tokyo Electron's single-wafer deposition system for 300 mm wafers. It combines an SFD nucleation layer with bulk deposition to fill features with high step coverage.

Maker: Tokyo Electron (TEL) · Official product page

Specifications

Wafer size	300 mm
Type	Single-wafer CVD (SFD nucleation layer + bulk film, lamp heating)
Target films	W (tungsten)
Series	Triase+ EX-II TiN / Ti/TiN / W / SPAi
Main applications	Contact plugs and via fill

Specifications as published by the maker. See the sources below.

Overview

Triase+ is Tokyo Electron's series of single-wafer deposition systems for 300 mm wafers, and Triase+ W is its tungsten (W) CVD configuration. It combines a nucleation layer formed by SFD (Sequential Flow Deposition) with bulk film deposition to fill fine contacts and vias with high step coverage.

It supports low-resistance films and uses lamp heating. Chamber cleaning does not use plasma. The main applications are contact plugs and via fill.

The series also includes Triase+ EX-II TiN, which deposits TiN and TiON with high step coverage by ASFD (capacitor electrodes, word line barriers, metal gates); Triase+ Ti/TiN, which lowers contact resistance while reducing junction leakage; and Triase+ SPAi, which uses low-temperature, low-damage plasma for steps such as gate nitridation. Each tool has up to 4 chambers.

Key features

High step coverage W fill with an SFD nucleation layer and bulk film
Low-resistance films with lamp heating
Plasma-free chamber cleaning
Single-wafer design with up to 4 chambers (common to the series)

Applications

Contact plugs
Via fill

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Sources

Tokyo Electron: Triase+ series product page