NE-550EX
A dry etching system for R&D using magnetically assisted ICP (ISM). It has the same chamber as the uGmni-200E production tool.
Maker: ULVAC · Official product page
Specifications
| Type | Magnetically assisted ICP (ISM), single wafer, load lock as standard |
|---|---|
| Substrate size | Up to Φ200 mm |
| Uniformity | Within ±5% (within wafer and wafer to wafer) |
Specifications as published by the maker. See the sources below.
Overview
NE-550EX is ULVAC's dry etching system using magnetically assisted ICP (ISM: ICP with Static Magnetic field). It is a compact, low-cost single-wafer model for R&D with a load lock chamber as standard.
Magnetic assistance produces plasma with lower pressure, lower electron temperature and higher density than other ICP methods, allowing control of a wide range of etching from ion-driven to radical-driven. A star electrode that prevents deposits on the RF window and a heating function emphasize repeatability and stability.
Because it has the same chamber as the uGmni-200E for production lines, it can handle many processes as a development tool. It is used to process compound materials for LEDs, LDs, VCSELs, RF and power devices, electrodes and metal wiring, and hard-to-etch materials such as ferroelectrics, noble metals and magnetic films.
Key features
- Magnetically assisted ICP (ISM)
- Star electrode prevents deposits
- Same chamber as the production tool
Applications
- Processing of compound devices
- Processing of hard-to-etch materials
Other dry etching equipment
- VERSALINE® ICP · Plasma-Therm Japan
- Tactras™ · Tokyo Electron (TEL)
- uGmni-200E · ULVAC
More from ULVAC
- CC-200 · PECVD equipment
- CCMT-D series · Vacuum gauges
- CME · PECVD equipment
- CME-200E · CVD equipment
- CS · Sputtering equipment
- ei-5 · Vacuum evaporation equipment
- ei-5 / EVD-600LP · Vacuum evaporation equipment
- ENTRON-EX W300 · PVD equipment
Sources
Dry etching equipment
Last updated: October 23, 2026