Episode™ 1
TEL's 300 mm single-wafer deposition platform that carries up to 8 process modules. It is used to lower contact resistance in advanced logic.
Specifications
| Type | Single-wafer deposition platform |
|---|---|
| Configuration | Up to 8 process modules (OPTCURE, ORTAS) |
| Main applications | Advanced logic contacts (pre-clean, CVD Ti) |
Specifications as published by the maker. See the sources below.
Overview
Episode 1 is a single-wafer deposition system for 300 mm wafers from Tokyo Electron (TEL). It belongs to the Episode series, which combines the volume production stability built up with Triase+ and the results of leading-edge R&D, and it can carry up to 8 process modules.
To handle the increasingly complex steps that come with scaling, it can run several processes in sequence. With OPTCURE, a module that removes native silicon oxide, and ORTAS, a module that deposits titanium, it lowers the contact resistance of metal wiring in advanced logic.
Enhanced tool data collection and an edge computing system support analysis applications that improve uptime and engineering efficiency. Data on operating status and energy use is stored in a database and also used to reduce environmental impact.
Key features
- Up to 8 process modules
- OPTCURE native oxide removal and ORTAS Ti deposition
- Data collection and edge computing
Applications
- Contact formation in advanced logic
Other cvd equipment
- QUIXACE®-II · Kokusai Electric
- Episode™ 2 DMR · Tokyo Electron (TEL)
- Triase+™ EX-II™ TiN · Tokyo Electron (TEL)
- Triase+™ Ti/TiN · Tokyo Electron (TEL)
- Triase+™ W · Tokyo Electron (TEL)
- CME-200E · ULVAC
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
Sources
Last updated: October 23, 2026